Samsung Electronics and AMD have deepened their long-standing partnership with a new Memorandum of Understanding (MOU) focused on next‑generation AI memory and computing technologies. The agreement, signed at Samsung’s advanced semiconductor complex in Pyeongtaek, Korea, expands collaboration across HBM4 supply, next-generation DDR5 development, foundry services, and rack‑scale AI infrastructure integration.
Under the MOU, Samsung will serve as the primary supplier of HBM4 memory for AMD’s upcoming Instinct™ MI455X GPU, the company’s next major accelerator for AI training and inference. The partnership also includes co‑development of advanced DDR5 memory solutions optimized for AMD’s 6th Gen EPYC™ processors, codenamed Venice, and systems built on the AMD Helios rack-scale architecture.
“Samsung and AMD share a commitment to advancing AI computing, and this agreement reflects the growing scope of our collaboration,” said Young Hyun Jun, Vice Chairman & CEO of Samsung Electronics. “From HBM4 and next‑generation DRAM to advanced packaging and foundry capabilities, Samsung is uniquely positioned to deliver turnkey solutions aligned with AMD’s expanding AI roadmap.”
“This collaboration brings together two leaders pushing the boundaries of AI infrastructure.”
— Dr. Lisa Su, Chair & CEO, AMD
Dr. Lisa Su emphasized the strategic importance of cross‑industry cooperation: “Powering the next generation of AI infrastructure requires deep collaboration across the industry. We are thrilled to expand our work with Samsung, uniting their leadership in advanced memory with our Instinct GPUs, EPYC CPUs and system‑level platforms.”
Samsung’s HBM4, the first in the industry to reach mass production, is built on its 6th‑generation 10nm‑class DRAM process and 4nm logic base die. Offering speeds up to 13 Gbps and 3.3 TB/s bandwidth, it provides the performance and efficiency required for large‑scale AI workloads.
The AMD Instinct MI455X GPU, powered by Samsung HBM4, is expected to become a cornerstone component for next‑generation AI clusters, providing the throughput essential for models that demand higher memory bandwidth and lower power consumption. Both companies will also evaluate opportunities for Samsung to manufacture select future AMD products through its foundry division.
Samsung and AMD’s partnership spans nearly two decades, covering graphics, mobile, and data center technologies. Most recently, Samsung’s HBM3E memory played a key role in AMD’s Instinct MI350X and MI355X AI accelerators.